I was reading quarterly report of AMD and came across this statement;
“The Company holds a 15% equity interest in two joint ventures (collectively, the ATMP JV) with affiliates of Tongfu Microelectronics Co., Ltd, a Chinese joint stock company.”
I thought ATMP is a name of a company but it turns out it simply stands for Assembly, Test, Mark, and Pack.
The name Tongfu triggered the connection of TF-AMD. I will drive by this factory whenever I am back home in Penang, so I went and check out its website. It identifies as a leader in the OSAT industry.
I became curious what OSAT means and how it is related to ATMP. So here it goes;
ATMP is simply the acronym of specific backend processes of semiconductor manufacturing. OSAT meanwhile stands for Outsourced Semiconductor Assembly and Test. It refers to companies that provides ATMP services, among others, to its customers.
In the semiconductor value chain, OSAT are backend players. They receive completed wafers from chip foundries (the likes of TSMC) who are identified as front end players.
Among the top OSAT companies are ASE Holdings, Amkor, Tongfu Microelectronics (which inlcudes TF-AMD), KYEC, and ChipMOS.
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